In anticipation of a future announcement of new Apple smartphone in the leaked another leak information. About their body and the glass was enough, and this time the focus of the printed circuit boards were related to devices iPhone 6 and iPhone Air with screen sizes of 4.7 and 5.5 inches respectively. Of course, before the official release gadgets authenticate the pictures can not fully.
In the images we can see three motherboards that belong iPhone 5s (in the center), iPhone 6 (left) and iPhone Air (right). The last two are the model numbers 820-3675-04 and 820-2486-09 common to all smartphones Apple. Central, owned by the current flagship is labeled 820-3382-06.
For greater reliability by comparing the picture leads boards new smartphones and their body image, noting the coincidence of the screw holes on the board and in the housing. At the moment, only the images show the board without chips installed on them that could give more information about the possibilities of future devices.
Nevertheless, both the board and for the iPhone 6 and iPhone Air indicate support for one of the technologies that Apple studiously avoided in the past. Until now, the company did not provide the data interface NFC, although every time rumors promised her appearance. And this time we are talking about the availability of contacts for NFC and faster wireless standard Wi-Fi 802.11ac.
Copyright images claims that they obtained from a reliable source. It should be noted that motherboard looks very similar to the iPhone 5s except for some minor changes: the board have become a little more, and Mount - longer.
Recall that the announcement of iPhone 6 and iPhone Air in two models is expected this fall.Presumably Apple will unveil the first smartphone September 19, September 25, it goes on sale. The device should get a 4.7-inch screen with a sapphire-coated screen. Later, is expected to launch a 5.5-inch version.