Taiwan resource Apple.club posted a picture of the motherboard network the iPhone 6 . circulated source images simultaneously confirmed some of the specifications of the future flagship. What insiders told, was not something new: Apple will change the form factor of the iPhone and endow the device support for new wireless interfaces.
On the published photograph shows the printed circuit board iPhone 6, which is substantially different in form and arrangement of parts of the same component iPhone 5s. In particular, it is somewhat longer. The main component of the board - the processor Apple A8 - hidden inside the electromagnetic shielding. In the right part of the picture you can see the SIM-card devices, to the left - flash drive.
Authors image argue that the motherboard carries signs of a smartphone built NFC-module, which will allow for contactless payments, as well as supporting communication standard Wi-Fi 802.11ac, theoretically doubling the performance of conventional configurations.
Now Apple is in full swing preparing for the autumn launch of iPhone 6. 4,7-inch version of the new flagship, as reported on the eve of the sources already in the final stages of testing .Smartphone is on the assembly lines Foxconn, which explains the large number of leaks in the last days. While volumes are very small, but the end of August Apple partners are going to significantly increase the volume of output of the new flagship.
As for the version of the iPhone 6 with 5.5-inch display, its assembly is rumored to start in September. At the same time start the mass production of tablets iPad Air 2 and iPad mini third generation, whose debut is scheduled for October.