Thursday, August 28, 2014

Motherboard iPhone 6 confirmed the presence of NFC-module

Members and experts have repeatedly criticized Apple for the lack of "apple" smartphone chips Near Field Communication, better known as NFC. But now the company seems to add support for near-contact communication technology in its next iPhone. It is reported by the resource GeekBar, published pictures of the motherboard upcoming smartphone.
iPhone-6-NFC-1

On the submitted photo shows the printed circuit board new iPhone 6 Display 4.7 and 5.5 inches, which differ greatly in form and arrangement of parts of the same component iPhone 5s. In particular, they are signs of smartphones built-in antenna NFC, which will allow for contactless payments. Source found on motherboards area of ​​5 x 5 mm, which is not available on the motherboard iPhone 5s and the same size with NFC-module NXP PN65. Last used in some smartphones on Android.
In favor of the fact that Apple decided to use technology NFC, is the fact that in January of this year, the Californian giant filed in the Patent Office an application for registration of a technology that is directly connected to this interface. In addition Apple has signed an agreement with the leadership of China UnionPay - national payment system in China, which was established in 2002. They are jointly developing a system of payments for purchases in retail stores Apple. They also have plans - UnionPay service integration with the company's program Passbook and adding support for iOS-devices in contactless payment application Quick Pass.
iPhone-6-NFC-2
From left to right: NFC on motherboards 4.7-inch iPhone 6, iPhone 5s, 5,5-inch iPhone 6 
As expected, Apple will introduce a new smartphone on September 9th. The individual sources of a number of media reports suggest that sales of the iPhone 6 may begin as early as September 19. The cost of new items can be higher due to the fact that Apple has used it more expensive sapphire crystal.
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