Chinese resource Ewisetech made a complete disassembly of the new flagship smartphone Sony Xperia Z3 to see what components are in the machine inside. The location of all "internal" is practically the same as in the Xperia Z2.
The back side is removed fairly easily, and it was revealed that her mount, a special insulating foam to prevent ingress of water into the unit. Inside the smartphone installed memory chip of Samsung, as well as numerous components from Broadcom and Qualcomm.
On assurance specialists Ewisetech, repair and replacement of components Sony Xperia Z3 performed quite simple and should not cause any problems. On the official website of the resource you can see photos of the process of dismantling the flagship.