Monday, April 6, 2015

IFixit experts put the flagship HTC One M9 deuce

IFixit staff evaluated the maintainability of the new flagship smartphone One M9. Complexity began even before the device started to disassemble, since the screen appeared scratched and broken pixel. Before assessing maintainability QC HTC can put a minus.

Disassemble the unit into separate components, the experts assigned HTC One M9 maintainability rating 2 out of 10. The battery of the smartphone is hidden under the baseboard and is associated with a frame body, which is very difficult to replace it. The display module can not be removed without dismantling the entire apparatus previously. Abundance adhesive makes removal and replacement of many components is very difficult and sometimes risky.
An autopsy revealed that the HTC One M9 applied operational and flash memory production Samsung: it chips K3RG3G30MM-MGCH 3 GB LPDDR4 RAM and KLMBG4GEND-B031 32 GB eMMC NAND.
Wireless capability provides a combined module Broadcom BCM4356 2 × 2 802.11ac Wi-Fi / Bluetooth 4.1. In addition, use the controller 47803 NXP NFC, transceiver Qualcomm WTR3925, Module Silicon Image SIL8620 MHL 3.0 and so on.
Only one aspect of the new smartphone HTC One M9 has earned praise from experts iFixit.Certain optimization design compared to its predecessor slightly simplified access to certain components. However, the overall design of the new product deserves a lot of criticism.
HTC One M9 has eight-processor Qualcomm Snapdragon 810, 5-inch display with a resolution of 1920 × 1080 pixels (441 ppi), 3 GB of RAM, 32-gigabyte drive, the main 20-megapixel camera, support for LTE, Bluetooth 4.1, NFC, Wi -Fi 802.11ac.